欧洲一区二区-欧美激情一区二区-国产激情在线-欧美在线一区二区

D-Sub高規格銜接器AMPHENOL

頒布期限：2023-09-06 16:40:00     閱讀：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub高比熱容對接器直線PCB線接有這兩種二極管封裝戰略布局材質：歐洲地區設計和軍民融合用戰略布局。配模塊沾染外表面始終如一為橘米黃色，能依據所需要的要的比較充足配頻點選擇五種一般板厚：閃亮金、15μ"和30μ"。學習點就能夠提拱精密制造自動化生產的軍民融合用級新版本（特殊電壓高至7.5A）以有保障防護耐用性，怎么才能夠可以提供更經濟社會且可民用的額定瞬時電流為3A的冷擠壓ios版本。

D-Sub高比熱容接入器原則款型常從A到E的5種基本上殼體產品規格，AMPHENOL的融合連接方式器在數據庫衛星信號、供電和同軸電覽問題體現了高達模型18個碰到點排例。堆疊（雙網絡端口）D-Sub高強度連結器物品系例很大豐富的。AMPHENOL新建發的當作PIP對焊細長（或沉式或短型）系統在AMPHENOL的房地產業顧客中才能得到成功失敗。除此外面，AMPHENOL還可不可以為每個app可以提供機器裝備，其中包含鋁合金蓋、橡膠防水蓋、保護區罩、制做機器裝備、胎兒性別轉化成和另一個自適應器。

共同點

要求D形對接器

EMI復合塑料殼

插頭線接地線提升裝置凹坑

放進件由安全性能好熱塑型可塑料定制而成

app房地產業公司公章碰到點

配備全座向線接范圍圖的變體

一些線接金橋銅業跨接線的截面積大小均能提供插座開關和電源插座

優勢與劣勢

保障正常的配合默契方面

核心應用于自動制作但減低價格的處理好方案設計

UL#E232356注冊

兼容種種用戶組所需

達到的標準規程

特殊性系統適用于于管腳焊錫膏或流入焊接方法

佛山市立維創展科技開發經售商經售AMPHENOL裝修公司其它方面企業產品產品，在AMPHENOL，AMPHENOL堅信在深入推進的業務的工作中作成可常期的抉擇是可以為控股股東創造出短期內和常期商業價值。AMPHENOL的企業每一個項業務部門都專注于于不停提高其設計，的采購，制做和竣工產品的措施，勤奮需要滿足或撼動企業對這個價值觀鏈中產品監管的意愿。AMPHENOL 的業務范圍將安全性高和場景保養看作首選重任，并依據ISO 14001和OHSAS 18001等排名第一條件的管理這工作計劃。因為，審核和規律正規性還欠缺。AMPHENOL不光僅嚴守法律法規就能創立持久實用價值。

詳情頁學習AMPHENOL可點擊：//www.anchor-appliance.cn/article/1321.html

AMPHENOL.png

PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


選擇介紹
  • 關于THUNDERLINE-Z產品申明
    關于THUNDERLINE-Z產品申明 2020-10-14 15:54:05 成都 市立維創展現代科技有限的有限，是法國THUNDERLINE-Z & Fusite知名品牌在國內 的軟件授權的區域代理，其材料波璃密封蓋接線端子排，已比較廣泛采用于航空航天、美國軍事、通信系統等高可信度性范疇。
  • CMD283C3超低噪聲MMIC放大器現貨庫存
    CMD283C3超低噪聲MMIC放大器現貨庫存 2025-08-22 16:41:29 Custom MMIC（現屬 Qorvo）的 CMD283C3 特低噪聲 MMIC 調大器主要包括 3x3 mm 無引線衛浴陶瓷 QFN 二極管封裝，幾率方向 2 - 6 GHz，兼具高增益控制、低噪聲、低額定功率等基本特性，采用以 S/C 波長多方向。